USB-C Explained: Why the Same Connector Delivers Different Charging Speeds and Data Rates
CC pins, e-marker chips, PD negotiation, and PCB signal integrity — the real engineering behind USB-C compatibility.
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Moore’s Law and Advanced Packaging: Why Chip Scaling Moved From the Transistor to the Interconnect
As lithography approaches atomic-scale limits, chiplets, substrates, and low-loss laminates have become the real engineering battleground for the next generation of performance gains.
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Choosing the Right High-Speed Laminate for AI Hardware: Megtron 6 vs. Megtron 8 vs. Tachyon 100G
As AI servers, GPUs, and 112G/224G networking push PCB signal integrity to its limits, selecting the right laminate is no longer optional. Here’s how Megtron 6, Megtron 8, and Tachyon 100G compare in dielectric loss, manufacturability, cost, and real-world AI hardware performance.
